40 x 26mm Heat Sink

Installation of this heatsink on the ODROID-C0 will minimize throttling due to CPU temperatures in many applications. This heatsink is identical to the one installed on the ODROID-C1+ by default.

KEY FEATURES

• 26 x 40 x 10 mm (approximately)
• 14g (approximately)
• Thermal interface pad is preinstalled (remove plastic protective film before installing)

NOTES

• DO NOT REMOVE THE WHITE THERMAL INTERFACE PAD! This is required to transfer heat from the SoC and memory chips to the heatsink and protect the PCB from electrical shorts!
• REMOVE THE CLEAR PROTECTIVE FILM BEFORE INSTALLATION! - Failure to do so will cause the SoC to heat up rapidly and defeat the purpose of the heatsink!
• MINIMIZE BENDING AND STRESS TO THE C0'S PCB DURING INSTALLATION AND REMOVAL!Failure to do so may cause damage to the C0!