Installation of this heatsink on the ODROID-C0 will minimize throttling due to CPU temperatures in many applications. This heatsink is identical to the one installed on the ODROID-C1+ by default.

KEY FEATURES

• 26 x 40 x 10 mm (approximately)
• 14g (approximately)
• Thermal interface pad is preinstalled (remove plastic protective film before installing)

NOTES

• DO NOT REMOVE THE WHITE THERMAL INTERFACE PAD! This is required to transfer heat from the SoC and memory chips to the heatsink and protect the PCB from electrical shorts!
• REMOVE THE CLEAR PROTECTIVE FILM BEFORE INSTALLATION! - Failure to do so will cause the SoC to heat up rapidly and defeat the purpose of the heatsink!
• MINIMIZE BENDING AND STRESS TO THE C0'S PCB DURING INSTALLATION AND REMOVAL!Failure to do so may cause damage to the C0!

Warranty is valid for two weeks, starting upon date of receipt.